Most modern electronics designed for rough environments are tested on a “shake and bake” machine, by the way.
Simulates years of expected vibration in months, as well as thermal cycles. Common failure points are found and corrected.
They’re neat machines. We tested telecom gear in them, and we weren’t really even expecting any vibration at all in the typical telecom environments other than during shipping, and we could control the G-forces imparted to components on boards by having g-shock warning stickers inside the packaging.
Hint: Never put g-shock devices on the outside of shipping boxes. The UPS and Fedex truck drivers will just hit them hard enough to set them off, for fun.
We did expect thermal cycling.
We took both the shaking and the baking (and freezing, the machines can do that too) to extremes well beyond what we rated the gear to operate at. It was a very severe test.
Always knew when a new product or board rev to fix something in hardware was being released. All the shake and bake machines except for one kept available for real time testing, were all running with their front doors locked and making various noises depending on what they were doing at the time, out on the manufacturing work floor.
I’m sure part of certification requires some level of shake and bake.